A revolutionary approach to power conversion. The Kiowa Class power stage eliminates the conventional power module entirely - a proprietary direct-die architecture delivering unprecedented power density, thermal performance, and reliability in a fraction of the envelope.
Engineered from day one for high-shock, high-temperature, mission-critical duty cycles. A single scalable platform serving motorsports, defense, aerospace, and advanced mobility programs. Details available to qualified partners under NDA.
SiC power electronics built for the applications that push performance to its limits - from the track to the flight line to the front line.
High Performance
Compact, high-power-density SiC inverters engineered for the thermal swings, vibration loads, and weight budgets of competitive motorsport programs. Purpose-built for performance where every kilogram counts.
Active programs - details under NDANDAA Compliant
Ruggedized platforms qualified for shock, vibration, and wide-temperature operation. NDAA compliant and architected for seamless integration into defense and aerospace programs with demanding certification requirements.
Active programs - details under NDAIndustrial Grade
Scalable SiC drives for high-cycle industrial applications. Common control and thermal architectures reduce qualification burden across platform variants and production volumes.
Accepting qualified partnersGeneral Electrification
Flexible reference designs that scale alongside your program - from prototype hardware to production volumes - with common architecture and shared thermal management across platform variants.
Accepting qualified partnersConventional power modules introduce a thermal resistance stack between die and coolant - substrate, solder, thermal interface material, baseplate. Each layer adds °C/W. At high power density, the module becomes the bottleneck, not the device. Switching frequency is capped. Operating temperature is limited. Size is fixed by packaging geometry.
The Kiowa Class power stage eliminates the module entirely. Silicon carbide die mount directly to a precision-machined cold plate, removing multiple layers of thermal resistance and enabling sustained 190°C junction temperature. Smaller, lighter, and with no foreign-sourced module in the power path - NDAA compliant by architecture, not by paperwork.
500kW
190°C
kW → MW
NDAA Ready
No foreign-sourced power modules in the critical path. NDAA compliance is a product of the architecture - not an afterthought applied to a commodity bill of materials.
Designed from first principles for high-shock, high-temperature, mission-critical environments. No derating for benign conditions - full-rated performance in the field.
Eliminates the conventional power module entirely. Direct-die architecture delivers a shorter thermal path, smaller envelope, lower mass, and a supply chain with no foreign-sourced critical components.
Common hardware and software architecture across voltage classes and program types. One platform from first prototype to production volume - qualification work carries forward.
NDA-backed partner support from first contact. Engineering resources aligned to your program schedule and timeline from day one - not after a six-month sales cycle.
We work with a limited number of qualified development partners at any given time. Kick off a discovery call and get a proposed path to hardware in under two weeks.
Technical datasheets and program details available under NDA to qualified partners.
Technical notes, thermal engineering analysis, and program updates from the SiCore team.
We work with a select number of development partners at any given time. Tell us about your program - power requirements, thermal constraints, timeline - and we'll determine if there's a fit within 48 hours.
